Full Screen


  • TDR, TDT and VNA measurements
  • 2 – 24 Port Ultra-compact TDR units
  • For assembled and bare backplanes and line cards
  • Totally integrated solution

Additional information

Fault Coverage
Bent Under Compliant Pins (under connector)

Missing Compliant Pins (under connector)

Concertina Compliant Pins (under connector)

Incorrect Back Drilling

Skew Faults

Impedance Faults



Test Functions
TDR High Speed SI Test

TDT High Speed SI Test
VNA High Speed SI Test

Board Type
Assembled Boards
Bare Boards
Download Machine Comparison Chart
1- Single Sided Only
2 - Using TDR/VNA Measurement (depends on board architecture)


  • Manual or semi-automatic operation
  • Available with up to four test heads
  • Test heads available with either 8, 16 or 24 port integrated TDR units or single port integrated VNA units
  • High specification, ultra-compact TDR units:
    • 12ps rise time
    • 35 GHz bandwidth
    • 1ps time base
  • High specification, ultra-compact 1 MHz – 43.5 GHz VNA units.
  • Test heads can be connected into customer’s existing TDR or VNA units
  • Suitable for Backplanes and Linecards (both assembled and bare)
  • Semi-automatic tool changer
  • 1µ encoders fitted to X and Y axes
  • Micro adjustments of 5µ for extremely accurate alignment of test module to PCB
  • Each test XY position can be recorded to enable the operator to return to the exact same location on a subsequent board. Ideal for batch testing
  • Software will guide the operator to each recorded XY position
  • Motorised axes available for semi-automatic operation
  • Full range of TDR & VNA tests and measurements available; Impedance, Skew, Backdrill discrepancies, Calculated differential
  • Custom assembled test modules – all high-speed connectors catered for
  • Custom bare board modules

Documents & Downloads